Display module including sensor and electronic device including the display module

ABSTRACT

An electronic device includes a display module including: a housing; a display including a first panel including a first surface, a second surface opposite the first surface, and a plurality of pixels interposed between the first surface and the second surface; a cover layer disposed on the first surface of the first panel; a second panel disposed on the second surface of the first panel; and a sensor coupled to the second surface of the first panel to provide a sensing area on the one surface of the housing.

CROSS-REFERENCE TO RELATED APPLICATION

This application is based on and claims priority under 35 U.S.C. § 119to Korean Patent Application No. 10-2019-0054182, filed on May 9, 2019,in the Korean Intellectual Property Office, the disclosure of which isincorporated by reference herein its entirety.

BACKGROUND 1. Field

The disclosure relates to a display module including a sensor and anelectronic device including the display module.

2. Description of Related Art

An electronic device may include a sensor to recognize biometricinformation. For example, the electronic device may include a sensor torecognize a fingerprint. The sensor to recognize the fingerprint may beviewed from the outside of the electronic device. For example, thesensor to recognize the fingerprint may be disposed at a lower endportion of a display area on a front surface of a housing in theelectronic device. For another example, the sensor to recognize thefingerprint may be disposed on a rear surface of the housing in theelectronic device.

As the size of a display in a portable electronic device is increased,the size of an area other than the display in the electronic device maybe more decreased. Accordingly, research and studies have beencontinuously performed to mount various sensors on the front surface ofthe electronic device while increasing the size of the display. Forexample, attempts have been performed to implement a large-scale screenby disposing a fingerprint sensor of the electronic device in a displayarea of the display and reducing or removing a non-display area.

A sensor may be disposed on a rear surface of a display module. Thedisplay module may include a light shielding panel attached to the rearsurface of a display panel. A hole may be formed in at least a partialarea of the light shielding panel to obtain a fingerprint, which isinput from the front surface of the display module, on the rear surfaceof the display. In this case, a hole having a size larger than that of asensor surface of the sensor may be formed to insure the minimum spaceand interference in a process. When the sensor is mounted, an air gapmay be formed between the sensor and the hole.

External light may be introduced into the display panel through the airgap. A photoelectric effect may be generated by the external light thathas been introduced. A leakage current may be caused in a thin filmtransistor (TFT), which is to adjust the brightness of at least onepixel of the display, due to the photoelectric effect. When the displaydisplays a lower-grayscale image, a display area corresponding to theair gap may be viewed brighter than another portion of the display, dueto the leakage current. When the display displays a higher-grayscaleimage, the display area corresponding to the air gap may be vieweddarker than another portion of the display, due to the leakage currentresulting from the photoelectric effect. Accordingly, the air gap may bevisually recognized by a user, due to the brightness difference of thedisplay area.

The above information is presented as background information only toassist with an understanding of the disclosure. No determination hasbeen made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the disclosure.

SUMMARY

Embodiments of the disclosure address at least the above-mentionedproblems and/or disadvantages and to provide at least the advantagesdescribed below.

In accordance with an example embodiment of the disclosure, anelectronic device may include: a housing; a display including a firstpanel having a first surface, a second surface opposite the firstsurface, and a plurality of pixels interposed between the first surfaceand the second surface; a cover layer disposed on the first surface ofthe first panel; a second panel disposed on the second surface of thefirst panel; and a sensor coupled to the second surface of the firstpanel of the display. The display may include an opening in the secondpanel configured to accommodate at least a portion of the sensor in theopening, the second panel may include a first layer coupled to the firstpanel on one surface of the second panel, and a second layer coupled tothe first layer on a surface opposite the one surface of the firstlayer, the opening may include a first opening in the first layer, thefirst opening may be provided inside a closed area of a second openingin the second layer, and a circumference of the first opening may bespaced apart from a circumference of the second opening on the secondlayer by at least a specified distance.

In accordance with an example embodiment of the disclosure, a displaymodule may include: a first panel having a first surface, a secondsurface opposite the first surface, and a plurality of pixels interposedbetween the first surface and the second surface; a cover layer disposedon the first surface of the first panel; a second panel disposed on thesecond surface of the first panel; and a sensor coupled to the secondsurface of the first panel. The second panel may include a first layercoupled to the first panel on one surface of the second panel and asecond layer coupled to the first layer on a surface opposite the onesurface of the first layer, the second panel may include an opening inthe second panel configured to accommodate at least a portion of thesensor in the opening, the opening may include a first opening in thefirst layer, the first opening may be provided inside a closed area of asecond opening in the second layer, and a circumference of the firstopening may be spaced apart from a circumference of the second openingon the second layer by at least a specified distance.

Other aspects, advantages, and salient features of the disclosure willbecome apparent to those skilled in the art from the following detaileddescription, which, taken in conjunction with the annexed drawings,discloses various example embodiments of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certainembodiments of the present disclosure will be more apparent from thefollowing detailed description, taken in conjunction with theaccompanying drawings, in which:

FIG. 1 is a front perspective view illustrating an example electronicdevice, according to an embodiment;

FIG. 2 is a rear perspective view illustrating the electronic device ofFIG. 1, according to an embodiment;

FIG. 3 is an exploded perspective view of the electronic device of FIG.1, according to an embodiment;

FIG. 4A is a cross-sectional view illustrating an example display of anelectronic device, according to an embodiment;

FIG. 4B is a cross-sectional view illustrating an example display of anelectronic device, according to an embodiment;

FIG. 5 is a diagram illustrating an example layer structure of a secondpanel, according to an embodiment;

FIG. 6 is an exploded perspective view illustrating an example display,according to an embodiment;

FIG. 7 is a diagram illustrating an example shape of an opening,according to an embodiment;

FIG. 8A is a diagram illustrating an example sensor mounting structure,according to an embodiment;

FIG. 8B is a cross-sectional view illustrating an example display moduletaken along line B-B′ of FIG. 8A, according to an embodiment;

FIG. 9A is a diagram illustrating an example sensor mounting structureapplied with a light shielding material, according to an embodiment;

FIG. 9B is a cross-sectional view illustrating an example display moduletaken along line C-C′ of FIG. 9A, according to an embodiment;

FIG. 10A is a diagram illustrating an example sensor mounting structureincluding a wall structure, according to an embodiment;

FIG. 10B is a cross-sectional view illustrating an example displaymodule taken along line D-D′ of FIG. 10A, according to an embodiment;

FIG. 11A is a diagram illustrating an example sensor mounting structureapplied with a light shielding adhesive material, according to anembodiment;

FIG. 11B is a cross-sectional view illustrating an example displaymodule taken along line E-E′ of FIG. 11A, according to an embodiment;

FIG. 12 is a diagram illustrating an example method of applying a lightshielding adhesive material, according to an embodiment;

FIG. 13 is a diagram illustrating an example method of applying a lightshielding adhesive material, according to an embodiment;

FIG. 14 is a diagram illustrating an example opening structure,according to an embodiment;

FIG. 15 is a diagram illustrating an example method for mounting asensor in an opening structure of FIG. 14, according to an embodiment;

FIG. 16 is a diagram illustrating an example mounting structure of asensor mounted according to the mounting method of FIG. 15, according toan embodiment; and

FIG. 17 is a diagram illustrating an example sensor mounting structureincluding a wall structure, according to an embodiment;

In the following description made with respect to the accompanyingdrawings, similar components will be assigned similar referencenumerals.

DETAILED DESCRIPTION

Hereinafter, various example embodiments of the disclosure may bedescribed with reference to accompanying drawings. However, those ofordinary skill in the art will understand that the disclosure is notlimited to a specific embodiment, and various modifications,equivalents, and/or alternatives on the various example embodimentsdescribed herein can be variously made without departing from the scopeand spirit of the disclosure.

FIG. 1 is a front perspective view illustrating an example electronicdevice, according to an embodiment. FIG. 2 is a rear perspective viewillustrating the electronic device of FIG. 1, according to anembodiment.

Referring to FIGS. 1 and 2, an electronic device 100 may include ahousing 110 including a first surface 110A (or front surface), a secondsurface 110B (or rear surface), and a side surface 110C surrounding thespace between the first surface 110A and the second surface 110B.

In another embodiment (not illustrated), the housing 110 may be referredto as the structure forming some of the first surface 110A, the secondsurface 110B, and the side surface 110C of FIG. 1.

According to an embodiment, the first surface 110A may include a frontplate 102 (e.g., a glass plate or a polymer plate including variouscoating layers) having at least a portion substantially transparent. Thesecond surface 110B may be formed through a rear plate 111 substantiallyopaque. The rear plate 111 may include, for example, coating or coloredglass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS),or magnesium) or the combination of at least two of the above materials.The side surface 110C may include a side bezel structure (or “sidemember”) 118 which is coupled to the front plate 102 and the rear plate111, and includes metal and/or polymer.

In an embodiment, the rear plate 111 and the side bezel structure 118may be formed integrally with each other and may include the samematerial (e.g., a metal material such as aluminum).

In the illustrated embodiment, the front plate 102 may include two firstareas 110D, which are bent toward the rear plate 111 from the firstsurface 110A while seamlessly extending, at opposite long edge ends ofthe front plate 102.

In an embodiment illustrated (see FIG. 2), the rear plate 111 mayinclude two second areas 110E bent from the second surface 110B towardthe front plate 102 while seamlessly extending and formed at oppositelong edge ends of the rear plate 111.

In an embodiment, the front plate 102 (or the rear plate 111) mayinclude only one of the first areas 110D (or the second areas 110E). Inan embodiment, the front plate 102 (or the rear plate 111) may notinclude some of the first areas 110D (or the second areas 110E).

In embodiments, when viewed from the side surface of the electronicdevice 100, the side bezel structure 118 may have a first thickness (orwidth) at the side surface (e.g., a shorter side) having no first area110D or second area 110E, and may have a second thickness thinner thanthe first thickness at the side surface (e.g., a longer side) includingthe first areas 110D or the second areas 110E.

In an embodiment, the electronic device 100 includes at least one adisplay 101, audio modules 103, 107, and 114, sensor modules 104, 116,and 119, camera modules 105, 112, and 113, a key input device 117, alight emitting device 106, and connector holes 108 and 109. In anembodiment, the electronic device 100 may omit at least one (e.g., thekey input device 117 or the sensor module 104, or the light emittingdevice 106) of components or may additionally include other components.

The display 101 may be viewable, for example, through a substantialportion of the front plate 102. In an embodiment, at least a portion ofthe display 101 may be exposed through the front plate 102 including thefirst surface 110A and first areas 110D of the side surface 110C.

In an embodiment, the edge of the display 101 may be formedsubstantially identically to the shape of an adjacent outer shape of thefront plate 102. In another embodiment (not illustrated), to expand anarea for exposing the display 101, the distance between an outer portionof the display 101 and an outer portion of the front plate 102 may besubstantially uniformly formed.

In an embodiment, the surface (or the front plate 102) of the housing110 may include a screen display area formed as the display 101 isvisually exposed. For example, the screen display area may include thefirst surface 110A and first areas 110D of the side surface.

In the illustrated embodiment, the screen display areas 110A and 110Dmay include a sensing area 110F configured to obtain biometricinformation of a user. In the disclosure, that the screen display areas110A and 110D include the sensing area 110F that may overlap with thescreen display areas 110A and 110D. In other words, the sensing area110F may refer to an area to display visual information through thedisplay 101, which is similar to another area of the screen displayareas 110A and 110D and to additionally obtain the biometric information(e.g., a fingerprint) of the user.

In the illustrated embodiment, the screen display areas 110A and 110D ofthe display 101 may include an area 110G through which the first cameradevice 105 (e.g., a punch hole camera) may be visually exposed. At leasta portion of an edge of the area, through which the first camera device105 is exposed, may be surrounded by the screen display areas 110A and110D.

In another embodiment (not illustrated), the screen display areas 110Aand 110D of the display 101 may have a recess or an opening formed in aportion of the screen display areas 110A and 110D of the display 101 andmay include at least one of the audio module 114, the first sensormodule 104, and the light emitting component 106 aligned in line withthe recess or the opening.

According to another embodiment (not illustrated), the display 101 mayinclude the audio module 114, the sensor modules 104, 116, and 119, andthe light emitting device 106, on the rear surface of the screen displayareas 110A and 110D.

In another embodiment (not illustrated), the display 101 may be coupledor disposed adjacent to a touch sensing circuit, a pressure sensor tomeasure the intensity (pressure) of a touch, and/or a digitizer todetect the stylus pen based on an electromagnetic scheme.

In an embodiment, at least some of the sensor modules 104, 116, and 119and/or at least a portion of the key input device 117 may be disposed onthe side surface 110C (e.g., the first areas 110D and/or the secondareas 110E).

The audio modules 103, 107, and 114 may include the microphone hole 103and the speaker holes 107 and 114. The microphone hole 103 may have amicrophone disposed therein to obtain an external sound. In anembodiment, the microphone hole 103 may have a plurality of microphonesdisposed therein to sense the direction of a sound. The speaker holes107 and 114 may include the external speaker hole 107 and the receiverhole 114 for conversation. In an embodiment, the speaker holes 107 and114 and the microphone hole 103 may be implemented into one hole or aspeaker may be included without the speaker holes 107 and 114 (e.g., apiezoelectric speaker).

In an embodiment, the sensor modules 104, 116, and 119 may generateelectrical signals or data values corresponding to an internal operatingstate of the electronic device 100 or an external environment state ofthe electronic device 100. For example, the sensor modules 104, 116, and119 may include the first sensor module 104 (e.g., a proximity sensor)disposed on the first surface 110A of the housing 110, the second sensormodule 116 (e.g., a TOF camera device) disposed on the second surface110B of the housing 110, the third sensor module 119 (e.g., a HRMsensor) disposed on the second surface 110B of the housing 110 and/or afourth sensor module (e.g., a sensor 190 of FIG. 3 (e.g., a fingerprintsensor)) coupled to the display 101.

In various embodiments, the second sensor module 116 may include a TOFcamera device for distance measurement.

In various embodiments, at least a portion of the fourth sensor module(e.g., the sensor 190 of FIG. 3) may be disposed under the screendisplay areas 110A and 110D. For example, the fourth sensor module maybe disposed in a recess (e.g., the recess 139 of FIG. 3) formed in therear surface of the display 101. In other words, the fourth sensormodule (e.g., the sensor 190 of FIG. 3) is not exposed through thescreen display areas 110A and 110D, and the sensing area 110F may beformed in at least a portion of the screen display areas 110A and 110D.

In an embodiment (not illustrated), the fingerprint sensor may bedisposed on the second surface 110B as well as the first surface 110A(e.g., the screen display areas 110A and 110D) of the housing 110.

In various embodiments, the electronic device 100 may further include atleast one of a sensor module, which is not illustrated, for example, atleast one of a gesture sensor, a gyro sensor, an air pressure sensor, amagnetic sensor, an acceleration sensor, a grip sensor, a color sensor,an infrared sensor, a biometric sensor, a temperature sensor, a humiditysensor, or an illuminance.

The camera modules 105, 112, and 113 may include the first camera device105 (e.g., a punch hole camera device) exposed through the first surface110A of the electronic device 100, the second camera device 112 exposedthrough the second surface 110B and/or the flash 113.

In the illustrated embodiment, the first camera device 105 may beexposed through a portion of the first surface 110A. For example, thefirst camera device 105 may be exposed through an opening (notillustrated) formed in a portion of the display 101.

In the illustrated embodiment, the second camera device 112 may includea plurality of camera devices (e.g., a dual camera, or a triple camera).However, the second camera device 112 is not necessarily limited toincluding a plurality of camera devices, and may include a single cameradevice.

The camera devices 105 and 112 may include one or more lenses, an imagesensor, and/or an image signal processor. The flash 113 may include, forexample, a light emitting diode or a xenon lamp. In some embodiments,two or more lenses (infrared camera, wide-angle and telephoto lenses)and image sensors may be disposed on one side of the electronic device100.

The key input devices 117 may be disposed on the side surface 110C ofthe housing 110. In another embodiment, the electronic device 100 maynot include some or all of the key input devices 117 mentioned above,and the some or the all of the key input devices 117, which is notincluded, may be implemented in different forms, such as a soft key, onthe display 101. In an embodiment, the key input devices 117 may includea sensor module (e.g., the sensor 190 of FIG. 3) forming the sensingarea 110F included in the screen display areas 110A and 110D.

The light emitting device 106 may be, for example, disposed on the firstsurface 110A of the housing 110. The light emitting device 106 mayprovide, in the form of light, the state information of the electronicdevice 100. In another embodiment, the light emitting device 106 may,for example, provide light linked to the operation of the first cameradevice 105. The light emitting device 106 may include, for example, anLED, an IR LED, and a xenon lamp.

The connector holes 108 and 109 may include the first connector hole 108to receive a connector (for example, a USB connector) to transmit orreceive power and/or data together with an external electronic device,and/or the second connector hole 109 (for example, an earphone jack) totransmit or receive an audio signal together with the externalelectronic device.

FIG. 3 is an exploded perspective view illustrating the electronicdevice of FIG. 1, according to an embodiment.

Referring to FIG. 3, the electronic device 100 may include a side member140 (e.g., a side housing), a first support member 142 (e.g., abracket), a front plate 120, a display 130 (e.g., the display 101 ofFIG. 1), a printed circuit board 150, a battery 152, a second supportmember 160 (e.g., a rear case), an antenna 170, and a rear plate 180. Inan embodiment, the electronic device 100 may omit at least one (e.g.,the first support member 142 or the second support member 160) ofcomponents or may additionally include other components. At least one ofcomponents of the electronic device 100 may be identical to or similarto at least one of components of the electronic device 100 of FIG. 1 orFIG. 2, and the duplicated description may not be repeated here.

The first support member 142 is disposed in the electronic device 100 tobe coupled to the side member 140 or to be integrated with the sidemember 140. The first support member 142 may include, for example, ametal material and/or a non-metal material (e.g., polymer). The firstsupport member 142 may have one surface coupled to the display 130 andan opposite surface coupled to the printed circuit board 150. Aprocessor, a memory, and/or an interface may be mounted on the printedcircuit board 150. The processor may include, for example, one or moreof a central processing unit, an application processor, a graphicprocessing unit, an image signal processor, a sensor hub processor, or acommunication processor.

The memory may include, for example, a volatile memory and/or anon-volatile memory.

The interface may include, for example, a high definition multimediainterface (HDMI), a universal serial bus (USB) interface, an SD cardinterface, and/or an audio interface. The interface may, for example,electrically or physically connect the electronic device 100 with theexternal electronic device and may include a USB connector, an SDcard/MMC connector, or an audio connector

The battery 152 may include a device to supply power to at least onecomponent of the electronic device 100, for example, a non-rechargeableprimary battery, or a rechargeable secondary battery, or a fuel cell. Atleast a portion of the battery 152 may be, for example, on substantiallycoplanar with the printed circuit board 150. The battery 152 may bedisposed inside the electronic device 100 integrally with the electronicdevice 100, and may be disposed detachably from the electronic device100.

The antenna 170 may be interposed between the rear plate 180 and thebattery 152. The antenna 170 may include, for example, a near fieldcommunication (NFC) antenna, a wireless charging antenna, and/or amagnetic secure transmission (MST) antenna. The antenna 170 may makeshort-range communication with an external device or may wirelesslytransmit or receive power necessary for charging. In another embodiment,an antenna structure may be formed by a portion of the side member 140and/or the first support member 142 or the combination of the sidemember 140 and the first support member 142

In the illustrated embodiment, the electronic device 100 may furtherinclude the sensor 190 coupled to the display 130. At least a portion ofthe sensor 190 may be disposed in the recess 139 (e.g., an opening 225of FIGS. 4A and 4B) formed in the rear surface of the display 130. Thesensor 190 may include a sensing area (e.g., the sensing area 110F ofFIG. 1) formed at a portion of the first plate 120.

FIG. 4A is a cross-sectional view illustrating an example display module200 of the electronic device 100, according to an embodiment. FIG. 4B isa cross-sectional view taken along line A-A′ of FIG. 3, according to anembodiment.

For example, the display module 200 may include display panels 210, 220,and 230 (e.g., the display 130 of FIG. 3) and a sensor 240 (e.g., thesensor 190 of FIG. 3). For another example, the display module 200 mayinclude the displays 210, 220, and 230 and the sensor 240 may be coupledto the display module 200.

In the illustrated embodiment, the display module 200 may include thefirst panel 210 including a plurality of pixels 213, the cover layer 230disposed on a first surface 211 (e.g., +Z axis direction) of the firstpanel 210, and the second panel 220 disposed on a second surface 212(e.g., −Z axis direction) of the first panel 210. For example, thesensor 240 may be coupled to the first panel 210. The first panel 210may be disposed between the second panel 220 and the cover layer 230.

In the illustrated embodiment, the first panel 210 may include the firstsurface 211 facing a first direction (e.g., +Z axis direction) and thesecond surface 212 facing a second direction (e.g., −Z axis direction)opposite to the first direction. The first direction may be, forexample, a direction (e.g., a direction facing the first plate 120 ofFIG. 3) facing the front surface of the electronic device 100, and thesecond direction may be a direction (e.g., a direction facing the secondplate 180 of FIG. 3) facing the rear surface of the electronic device100.

In the illustrated embodiment, the cover layer 230 may form at least aportion (e.g., the first plate 120 of FIG. 3) of a first plate, at leasta portion of the cover layer 230 may form a first surface (e.g., thefirst surface 110A of FIG. 1) of the housing (e.g., the housing 110 ofFIG. 1), or may form the surface of the electronic device 100.

In various embodiments, the cover layer 230 may be transparently formed.The cover layer 230 may include a transparent material. In variousembodiments, the cover layer 230 may include various materials. Forexample, the cover layer 230 may include a material of a glass orpolymer (e.g., polyimide (PI), polyethylene terephthalate (PET)).

In various embodiments, the cover layer 230 may have a screen displayarea 201 formed by the first panel 210 disposed in the second direction(e.g., −z axis direction) of the cover layer 230. In addition, the coverlayer 230 may have a sensing area 202 formed by the sensor 240. Forexample, the sensing area 202 and the screen display area 201 may atleast partially overlap with each other.

In various embodiments, the sensor 240 may transmit, receive, and/orsense a signal (e.g., an optical signal or an ultrasonic signal). Forexample, the signal may travel toward a portion (e.g., a fingerprint ofa finger) of a body of a user through the sensing area 202 from thesensor 240, and the signal reflected by a portion of the body of theuser may be received by the sensor 240 through the sensing area 202again. For another example, the signal may be emitted from at least aportion of the first panel 210, and the signal reflected by the portionof the body of the user may be received by the sensor 240 through thesensing area 202.

In the illustrated embodiment, the first panel 210 may include a pixellayer including the plurality of pixels 213. The pixel layer may includethe screen display area 201 formed on the first plate (e.g., the firstplate 120 of FIG. 3; the front surface of the electronic device 100). Inan embodiment, the first panel 210 may further include a touch layer(not illustrated) including a plurality of touch sensors.

In the illustrated embodiment, the second panel 220 may include a firstlayer 510 and a second layer 520. FIG. 5 illustrates an example layerstructure of the second panel 220, according to an embodiment.

Referring to FIG. 5, the second panel 220 may optically and/orelectrically shield the first panel 210.

According to an embodiment, the first layer 510 may refer to a layer tooptically shield the first panel 210. For example, the first layer 510may include, for example, a black embo-layer (e.g., a black layerincluding an irregular pattern). The first layer 510 may include anembossed pattern formed in at least one surface of the first layer 510to prevent and/or reduce light or moisture from being introduced intothe first panel 210. The first layer 510 may include, for example, afirst adhesive layer 324, a black polymer layer 323, and a secondadhesive layer 322.

For example, the first adhesive layer 324 may include, for example, adouble-sided adhesive member that bonds the first panel 210 with thesecond panel 220. A surface (e.g., a surface in the z+ direction), whichfaces the first panel 210, of the first adhesive layer 324 may beapplied, in an irregular shape, with an adhesive material, to preventand/or reduce bubbles from being formed. The first adhesive layer 324may be interposed between the first panel 210 and the black polymerlayer 323.

For example, the black polymer layer 323 may be interposed between thefirst adhesive layer 324 and the second adhesive layer 322. The blackpolymer layer 323 may include a black material (e.g., ink) to preventand/or reduce external light from being introduced into the first panel210 through the second panel 220. For example, the black polymer layer323 may include a layer to maintain the panel of the first layer 510 tobe in the irregular pattern (e.g., the embossed pattern). For example,the black polymer layer 323 may be interposed between the first adhesivelayer 324 and the second adhesive layer 322. The irregular pattern ofthe black polymer layer 323 may prevent and/or reduce bubbles from beingformed when the first layer 510 is attached to the second layer 520.According to an embodiment, the black polymer layer 323 may include aplurality of layers. For example, the black polymer layer 323 mayinclude a black layer having a light shielding property and a polymerlayer having an embossed pattern.

According to an embodiment, the first layer 510 may further include thesecond adhesive layer 322 to combine the first layer 510 with the secondlayer 520.

According to an embodiment, the second layer 520 may include a layer toelectrically shield the display module and/or to radiate heat. Forexample, the second layer 520 may include a buffer member 321 and a rearsurface layer 531. The second layer 520 may be attached to a surfaceopposite to a surface, which is attached to the first panel 210, of thefirst layer 510.

For example, the buffer member 321 may correspond to an impact absorbingmember to absorb an impact.

For example, the rear surface layer 531 may include a shielding layerand/or a heat radiation layer. The shielding layer may shield anotherelectrical component (e.g., an electrical device disposed on a printedcircuit board) from noise, which is produced from the display module200. According to an embodiment, the shielding layer may include acopper (Cu) sheet. According to an embodiment, the heat radiation layermay include a graphite material. The rear surface layer 531 may furtherinclude an adhesive layer (not illustrated) to combine the buffer member321 with remaining layers.

The first layer 510 and the second layer 520 illustrated in FIG. 5 areprovided for the illustrative purpose, and the embodiments in thedisclosure is not limited thereto. For example, the first layer 510 maybe a layer at least including layers between the light shielding layer(e.g., the black layer 323) and the first panel 210.

The structure of the second panel 220 illustrated in FIG. 5 is providedfor the illustrative purpose, and the embodiments in the disclosure arenot limited thereto. For example, the second panel 220 disclosed in thedisclosure may include layers stacked in order different from the orderthat the layers illustrated in FIG. 5 are stacked, may further includean additional layer, or may not have some layers.

Referring back to FIG. 4A, according to various embodiments, the displaymodule 200 may further include a protection film (PF) (not illustrated).For example, the protection film (PF) may be interposed between thefirst panel 210 and the second panel 220 to protect the first panel 210.For another example, the protection film (PF) may be included in thefirst panel 210.

In the illustrated embodiment, the display module 200 may include theopening 225 formed through the second panel 220. For example, theopening 225 may have a rectangular, square, circular, or oval shape whenthe display module 200 is viewed in the +z axis direction. For anotherexample, the opening 225 may have the shape corresponding to thecombination of various shapes. According to an embodiment, the opening225 may be formed through the second panel 220 when viewed in the −zaxis direction. For example, the second surface 212 may be directlyexposed through the opening 225. For another example, the second surface212 may be visually exposed through the opening 225 and the protectionfilm (not illustrated). For another example, the protection film (PF)may be exposed through the opening 225. In this case, at least a portionof the sensor 240 may be disposed inside the opening 225. According toan embodiment, the opening 225 may include inner sidewalls having a stepdifference. For example, the opening 225 may include a first innersidewall 2261 formed at the first layer 510 and a second inner sidewall2262 formed at the second layer 520.

In the illustrated embodiment, the opening 225 may be referred to as arecess formed in the display module 200 or one surface of the display.For example, the recess may include a first recess (e.g., a recessformed by the second inner sidewall 2262) formed at the second layer 520and a second recess (e.g., a recess formed by the first inner sidewall2261) formed in the bottom surface of the first recess. The secondrecess may be formed inside the first recess to form a step-differencesurface on the bottom surface of the first recess. For example, therecess may include a bottom surface 2251, first inner sidewalls 2261facing each other, and second inner sidewalls 2262 facing each other.The first inner sidewalls 2261 may face each other with a width of atleast W1 and the second inner sidewalls 2262 may face each other with awidth of at least W2. For example, W2 may be greater than W1. The bottomsurface 2251 may include a portion of the second surface 212 of thefirst panel 210. The second inner sidewall 2262 includes an end surfaceof the second layer 520, which is generated from an opening (e.g., aclosed area) formed in the second layer 520 of the second panel 220, andthe first inner sidewall 2261 may include an end surface of the firstlayer 510, which is generated from an opening (e.g., a closed area)formed in the first layer 510 of the second panel 220.

For example, the opening 225 may be formed to be larger than the sensor240 such that the width W1 between the first inner sidewalls 2261 isgreater than the side surface of at least a portion of the sensor 240,which is to be mounted in the opening 225, by at least a specificdistance (e.g., ‘d’). The shape of the sensor 240 illustrated in FIG. 4Ais provided for the illustrative purpose, and the embodiments in thedisclosure are not limited thereto. For example, only a portion of thesensor 240 may be mounted in the opening 225, and a remaining portion ofthe sensor 240 may protrude from the opening 225. The size of theremaining portion, which protrudes from the opening 225, of the sensor240, may be greater than the opening 225.

In the illustrated embodiment, the sensor 240 may include a firstsurface 241 disposed to face the first panel 210, a second surface 242opposite to the first surface 241, and a side surface 243 interposedbetween the first surface 241 and the second surface 242.

According to various embodiments, the sensor 240 may be inserted intothe opening 225 such that the first surface 241 is attached to thebottom surface 2251 of the opening 225 and the side surface 243 isspaced apart from the first inner sidewall 2261 of the opening 225 by aspecific distance (e.g., 'd).

Hereinafter, the sensor 240 disclosed according to various embodimentsin the disclosure may include, for example, and without limitation, anultrasonic sensor. The ultrasonic sensor may be configured to obtainbiometric information (e.g., the structure of the fingerprint) of a userusing an ultrasonic wave having a specific frequency.

In various embodiments, the ultrasonic sensor transmits an ultrasonicwave toward a part of a body of the user close to (e.g., contact with)the sensing area 202 (e.g., the sensing area 110F of FIG. 1) formed atthe cover layer 230, and receives an ultrasonic wave reflected from thepart of the body of the user to obtain biometric information of theuser. For example, the sensor 240 may be an ultrasonic fingerprintsensor to obtain the fingerprint information of the user, and thebiometric information of the user may correspond to the fingerprint ofthe user. The structures of the display 200 and the sensor 240, whichhave been described with reference to FIG. 4A, are provided only for theillustrative purpose, and embodiments in the disclosure are not limitedthereto.

FIG. 4B is a cross-sectional view of the display 200 of an electronicdevice, according to an embodiment. Unless specified otherwise, thedescription made with reference to FIG. 4A may be similarly applied toan example of FIG. 4B.

Although FIG. 4A illustrates that the sensor 240 is attached to thebottom surface 2251 (e.g., the second surface 212 of the first panel210) of the opening 225, embodiments in the disclosure are not limitedthereto. Referring to FIG. 4B, according to an embodiment, the opening(e.g., the opening defined by the first inner sidewall 2261) at thefirst layer 510 may be smaller than the first surface 241 of the sensor240. In this case, a portion of the first surface 241 of the sensor 240may be positioned on a portion of the first layer 510.

FIG. 6 is an exploded perspective view illustrating the display 200,according to an embodiment.

As described with reference to FIGS. 4A and 4B, the display 200 mayinclude an opening (e.g., the opening 225 of FIGS. 4A and 4B) of thesecond panel 220 including inner sidewalls (e.g., the first innersidewall 2261 and the second inner sidewall 2262 of FIGS. 4A and 4B)having the step difference. For example, the opening 225 may include afirst opening 610 formed in the first layer 510 and a second opening 620formed in the second layer 520. When the first layer 510 is combinedwith the second layer 520, the first opening 610 is formed inside thesecond opening 620. A boundary of a second closed area formed by thesecond opening 620 may be spaced apart from a boundary of a first closedarea formed by the first opening 610 by a specified distance.

For example, after forming the first opening 610 and the second opening620, the first layer 510 and the second layer 520 may be combined witheach other. For another example, after combining the second layer 520having the second opening 620 with the first layer 510, the firstopening 610 may be formed through the second opening 620. A manner offorming the first opening 610 and the second opening 620 is provided forthe illustrative purpose, and embodiments in the disclosure are notlimited thereto.

FIG. 7 is a diagram illustrating an example shape of an opening,according to an embodiment.

According to an embodiment, the second opening 620 may be formed to havean offset from four surfaces of the first opening 610. For example, thesecond opening 620 may be spaced apart from a first side (e.g., a leftside perpendicular to the +X axis direction) of the first opening 610 bya specified distance (e.g., d1) in a first direction (e.g., +X axisdirection). For example, the second opening 620 may be spaced apart froma second side (e.g., an upper side perpendicular to the +Y axisdirection) of the first opening 610 by a specified distance (e.g., d2)in a second direction (e.g., +Y axis direction). For example, the secondopening 620 may be spaced apart from a third side (e.g., a lower sideperpendicular to the −Y axis direction) of the first opening 610 by aspecified distance (e.g., d3) in a third direction (e.g., −Y axisdirection). The second opening 620 may be spaced apart from a fourthside (a right side perpendicular to the −X axis direction) of the firstopening 610 by a specified distance (e.g., d4) in a fourth direction(e.g., −X axis direction). For example, the specified distance d4 may belonger than the specified distances d1, d2, and d3.

FIG. 8A is a diagram illustrating an example sensor mounting structure801, according to an embodiment. FIG. 8B is a cross-sectional view 802of a display module taken along line B-B′ of FIG. 8A, according to anembodiment.

Referring to FIGS. 8A and 8B, according to an embodiment, a sensor(e.g., the sensor 240 of FIGS. 4A and 4B) may be attached to the firstpanel 210 through the first opening 610. For example, the sensor 240 mayinclude a sensor circuit 810 and a connecting member 820 (e.g., aflexible printed circuit (FPCB)). For example, the sensor circuit 810may be attached to the first panel 210 through an adhesive material 890(e.g., resin or epoxy) applied on the first panel 210. The adhesivematerial 890, may, for example, be an adhesive material cured at a lowertemperature (e.g., a temperature of about 40° C. to about 60° C. orless), may be a light shielding material.

In the example of FIGS. 8A and 8B, a photo-curable adhesive material maybe used to fix the sensor 240 on the first panel 210 during the curingprocess of the adhesive material 890. For example, a plurality of UV(ultra-violet) adhesive points 891, 892, 893, and 894 may be used. Afterthe sensor circuit 810 is positioned on the first panel 210, the UVadhesive points 891, 892, 893, and 894 are formed, and the sensorcircuit 810 may be fixed onto the first panel 210 through UV curing.After fixing the sensor circuit 810 onto the first panel 210, the curingprocess (e.g., a heat treatment process and/or a bubble removingprocess) may be performed to cure the adhesive material 890. The UVadhesive points 891, 892, 893, and 894 are provided for the illustrativepurpose, embodiments in the disclosure are not limited thereto.According to an embodiment, a fixing process using the UV adhesivepoints 891, 892, 893, and 894 may be omitted.

As illustrated in FIGS. 8A and 8B, a space (e.g., an air gap) may bepresent between the adhesive material 890 and the first layer 510. Forexample, the air gap may be formed between the adhesive material 890 andthe first layer 510, along the circumference of the adhesive material890, or along the inner sidewall of the first layer 510. When a lightshielding material (e.g., the first layer 510 and/or the adhesivematerial 890) is not in the air gap, light from the outside may beintroduced through the air gap. According to an embodiment, the lightshieling material may be applied to the air gap to be filled in the airgap.

FIG. 9A is a diagram illustrating an example sensor mounting structure901 applied with a light shielding material, according to an embodiment.FIG. 9B is a cross-sectional view 902 of a display module taken alongline C-C′ of FIG. 9A, according to an embodiment.

Referring to FIGS. 9A and 9B, a light shielding material 910 may beapplied onto the first panel 210 along the inner sidewall of the firstopening 610. The light shielding material 910 covers the air gap, so theexternal light may be prevented from being introduced and/or may bereduced. For example, the light shielding material 910 may be a lowerviscosity material (e.g., epoxy or liquid) including a light shieldingingredient (e.g., a black ink). The light shielding material 910 is thelower viscosity material having a viscosity lower than a specifiedviscosity. Accordingly, the light shielding material 910 may be spreadalong the circumference of the adhesive material 890 which is applied toa point between the light shielding material 910 and the first layer 510and including an area covered by the connecting member 820. For example,the light shielding material 910 may be a material to be dried at a roomtemperature. For example, an additional heat treatment process is notrequired for the light shielding material 910, thereby preventing and/orreducing the performance from being deteriorated due to the heattreatment for the display module and the display.

As an amount of the light shielding material 910 is increased, the lightshielding material 910 may flow over the recess formed by the firstopening 610 in the first layer 510. When the light shielding material910 is absorbed into the second layer 520, the first layer 510 may bedelaminated from the second layer 520. In addition, the light shieldingdegree may be irregular due to the light shielding material 910absorbed. As illustrated in FIGS. 9A and 9B, a step-difference area ispresent between the first opening 610 and the second opening 620 toprevent and/or reduce the light shielding material 910 from reaching thesecond layer 520.

FIG. 10A is a diagram illustrating an example sensor mounting structure1001 including a wall structure, according to an embodiment. FIG. 10B isa cross-sectional view 1002 of a display module taken along line D-D′ ofFIG. 10A, according to an embodiment.

According to an embodiment, a protrusion 1010 may be formed on the firstlayer 510. For example, the protrusion 1010, which may, for example,have a closed-loop shape, may be positioned in a space, which isinterposed between the circumference of the first opening 610 and theinner sidewall of the second opening 620, at the first layer 510 Theprotrusion 1010 may be a wall structure to prevent and/or reduce thelight shielding material 910 from being absorbed into the second layer520.

According to an embodiment, the protrusion 1010 may be formed on thefirst layer 510 before the sensor circuit 810 is bonded. For example,the protrusion 1010 may be an adhesive member (e.g., a tape) or anadhesive material (e.g., UV curable resin).

FIG. 11A is a diagram illustrating an example sensor mounting structure1101 applied with a light shielding adhesive material 1110, according toan embodiment. FIG. 11B is a cross-sectional view 1102 of a displaymodule along line E-E′ in FIG. 11A, according to an embodiment.

According to an embodiment, the light shielding adhesive material 1110(e.g., the adhesive material 890 of FIGS. 8A and 8B) may be applied toall areas of the first panel 210 exposed through the first opening 610.In this case, the all areas of the first panel 210 may be covered withthe light shielding adhesive material 1110, so the air gap describedwith reference to FIGS. 8A and 8B may be removed.

As illustrated in FIGS. 11A and 11B, after the light shielding adhesivematerial 1110 is applied to the first panel 210 through the firstopening 610, the sensor circuit 810 may be attached to the first panel210 through a compressing process. In this case, the light shieldingadhesive material 1110 may overflow out of the recess, which is formedby the first opening 610 in the first layer 510, through the compressingprocess. The second opening 620 is formed to be larger than the firstopening 610. Accordingly, the light shielding adhesive material 1110overflowing the first layer 510 may be prevented from and/or avoid beingabsorbed into the second layer 520. For another example, the displaymodule 200 may further include a wall structure described with referenceto FIGS. 10A and 10B.

According to an embodiment, the light shielding adhesive material 1110may include, for example, and without limitation, black ink, an epoxyfilm, a die attach film (DAF), and/or a polyimide (PI) shielding film.For example, the light shielding adhesive material 1110 may be alower-temperature fast cure adhesive material. For example, the lightshielding adhesive material 1110 may be a low-viscosity material to benaturally dried (e.g., at a room temperature).

FIG. 12 is a diagram illustrating an example method of applying a lightshielding adhesive material 1110, according to an embodiment.

According to an embodiment, the light shielding adhesive material 1110may, for example, be applied onto the first panel 210 in a pad printingtype.

Referring to reference numeral 1201, the light shielding adhesivematerial 1110 (e.g., epoxy) may be applied onto a pad 1210. For example,the pad 1210 may include a low hardness and flexible material. Referringto reference numeral 1202, the pad 1210 may allow the light shieldingadhesive material 1110 to be applied onto the whole area of the firstpanel 210, which is exposed through the first opening 610, through thecompressing process. The pad 1210 has a flexible property. Accordingly,the light shielding adhesive material 1110 may be applied depending onthe shape of the recess formed in the first layer 510. Referring toreference numeral 1203, after applying the light shielding adhesivematerial 1110, the sensor circuit 810 may be attached.

As described with reference to FIGS. 11A and 11B, the light shieldingadhesive material 1110 may be prevented from and/or avoid being absorbedinto the second layer 520 due to the step difference formed by the firstopening 610 and the second opening 620. According to an embodiment, thewall structure described with reference to FIGS. 10A and 10B may beformed before the compressing process of reference numeral 1202.

FIG. 13 is a diagram illustrating an example method of applying thelight shielding adhesive material 1110, according to an embodiment.

According to an embodiment, the light shielding adhesive material 1110may be applied onto the first panel 210 in a vacuum laminate type.

Referring to reference numeral 1301, the light shielding adhesivematerial 1110 (e.g., epoxy) may be applied onto a pad 1310. For example,the pad 1310 may include an end portion 1311 including a low hardnessand flexible material. Referring to reference numeral 1302, the pad 1310may allow the light shielding adhesive material 1110 to be applied ontothe whole area of the first panel 210, which is exposed through thefirst opening 610, through the compressing process. The end portion 1311has a flexible property. Accordingly, the light shielding adhesivematerial 1110 may be applied in the shape of the recess formed in thefirst layer 510. The light shielding adhesive material 1110 may beapplied in the shape of the recess by, for example, air-blowing throughthe end portion 1311, in the compressing process. Referring to referencenumeral 1303, after applying the light shielding adhesive material 1110,the sensor circuit 810 may be attached.

As described with reference to FIGS. 11A and 11B, the light shieldingadhesive material 1110 may be prevented from and/or avoid being absorbedinto the second layer 520 due to the step difference formed by the firstopening 610 and the second opening 620. According to an embodiment, thewall structure described with reference to FIGS. 10A and 10B may beformed before the compressing process of reference numeral 1302.

FIG. 14 is a diagram illustrating an example opening structure 1401,according to an embodiment.

According to an embodiment, the size of the first opening 610 formed inthe first layer 510 may be smaller than the sensor circuit 810. Forexample, the area, which is exposed through the first opening 610, ofthe first panel 210 may be smaller than the size of the surface (e.g.,the first surface 241 of FIGS. 4A and 4B) of the sensor circuit 810facing the first panel 210. The circumference of a closed area formed bythe first opening 610 may be smaller than the circumference of the firstsurface, which faces the first layer 510, of the sensor circuit 810. Forexample, the first opening 610 may correspond to a portion (e.g., asensing area) of the sensor circuit 810.

As illustrated in FIG. 14, because the first opening 610 is formed to besmaller than the sensor circuit 810, the whole area of the first opening610 in the first layer 510 may be covered by the sensor circuit 810.When viewed from the top (viewed in the +Z axis direction), the firstpanel 210 may not be exposed due to the sensor circuit 810 and the firstlayer 510.

FIG. 15 is a diagram illustrating an example method for mounting asensor in a sensor opening structure of FIG. 14, according to anembodiment.

Referring to reference numeral 1501, an adhesive material 1510 (e.g.,resin) may be applied into a recess formed in the first layer 510 by thefirst opening 610. For example, the adhesive material 1510 may beapplied in an amount capable of filling the entire portion of the recessformed in the first layer 510 by at least the first opening 610.

Referring to reference numeral 1502, the sensor circuit 810 may bepositioned on the first layer 510 to cover the first opening 610. Forexample, to ensure that the adhesive material 1510 is filled in theentire portion of the space formed through the first opening 610 betweenthe sensor circuit 810 and the first panel 210, the adhesive material1510 may be applied in an amount larger than an amount of an adhesivematerial applied into the recess formed in the first layer 510 by thefirst opening 610. In this case, an excess amount 1511 may overflow thefirst layer 510 depending on the compressing process of the sensorcircuit 810. The second opening 620 of the second layer 520 is formed tobe spaced apart from the circumference of the first opening 610.Accordingly, the excess amount 1511 may be prevented from and/or avoidcontaminating the second layer 520.

FIG. 16 illustrates a mounting structure 1601 of a sensor mountedthrough the mounting method of FIG. 15.

According to an embodiment, at least a portion of the sensor circuit 810may be attached to the first layer 510. For example, a portion (e.g., anedge) of the sensor circuit 810 may be coupled to an adhesive layer(e.g., the second adhesive layer 322 of FIG. 5) of the first layer 510.The sensor circuit 810 is fixed by the adhesive layer, so the fixing ofthe sensor circuit 810 required in the curing process of the adhesivematerial 1510 may be provided by the adhesive layer. According toanother embodiment, adhesive points 831, 832, 833, and 834 may bepositioned in at least some of the corners of the sensor circuit 810 tomore securely fix the sensor circuit 810.

FIG. 17 is a diagram illustrating an example sensor mounting structure1701 including a wall structure, according to an embodiment.

According to an embodiment, a display module may include a protrusion1710 formed on the first layer 510. For example, the protrusion 1710,which may, for example, have a closed-loop shape, may be positioned in aspace on the first layer 510, which is interposed between thecircumference of the sensor circuit 810 and the inner sidewall of thesecond opening 620. The protrusion 1710 may be a wall structure toprevent and/or reduce the adhesive material 1510 from being absorbedinto the second layer 520. For example, the protrusion 1710 may preventand/or reduce the excess amount 1511 of the adhesive material 1510 fromreaching the second layer 520.

According to an embodiment, the protrusion 1710 may be formed on thefirst layer 510 before the sensor circuit 810 is bonded. For example,the protrusion 1710 may be an adhesive member (e.g., a tape) or anadhesive material (e.g., UV curable resin).

According to various example embodiments, an electronic device (e.g.,the electronic device 100 of FIG. 1) may include: a housing (e.g., thehousing 110 of FIG. 1), a display (e.g., the display 101 of FIG. 1), anda sensor (e.g., the sensor 240 of FIGS. 4A and 4B). A display module mayinclude a first panel (e.g., the first panel 210 of FIGS. 4A and 4B)having a first surface, a second surface opposite the first surface, anda plurality of pixels interposed between the first surface and thesecond surface; a cover layer (e.g., the cover layer 230 of FIGS. 4A and4B) disposed on the first surface of the first panel; and a second panel(e.g., the second panel 220 of FIGS. 4A and 4B) disposed on the secondsurface of the first panel. A sensor may be coupled to the secondsurface of the first panel. For example, the sensor may form a sensingarea (e.g., the sensing area 110F of FIG. 1) on one surface of thehousing. The display may include an opening (e.g., the opening 225 ofFIGS. 4A and 4B) provided in the second panel and at least a portion ofthe sensor may be disposed in the opening, and the second panel mayinclude a first layer (e.g., the first layer 510 of FIG. 5) coupled tothe first panel on one surface of the second panel and a second layer(e.g., the second layer 520 of FIG. 5 coupled to the first layer on asurface opposite the one surface of the first layer. The opening mayinclude a first opening (e.g., the first opening 610 of FIG. 6) in thefirst layer, and the first opening may be provided inside a closed areaformed by a second opening (e.g., the second opening 620 of FIG. 6) inthe second layer. A circumference of the first opening may be spacedapart, by at least a specified distance, from a circumference of thesecond opening in the second layer.

According to an example embodiment, the second layer may include aconductive layer to provide electrical shielding, and the first layermay include a layer to provide optically shielding.

According to an embodiment, the sensor may be attached to the secondsurface of the first panel through an adhesive material (e.g., theadhesive material 890 of FIG. 9B) inside the first opening Theelectronic device may further include a light shielding material (e.g.,the light shielding material 910 of FIG. 9B) filled in a mounting areaprovided by the adhesive material of the second surface of the firstpanel and an area between the mounting area and the first opening. Forexample, the light shielding material may have a specified viscosity orless and may be dried at a room temperature.

According to an example embodiment, the electronic device may furtherinclude a protrusion (e.g., the protrusion 1010 of FIGS. 10A and 10B)disposed on the first layer in an area between the second opening andthe first opening, and having a closed-loop shape.

According to an example embodiment, the electronic device may furtherinclude a light shielding adhesive material (e.g., the light shieldingadhesive material 1110 of FIGS. 11A and 11B) applied to an area exposedthrough the first opening of the second surface of the first panel. Thesensor may be attached to the second surface of the first panel usingthe light shielding adhesive material. For example, the light shieldingadhesive material may be applied to an entire area exposed through thefirst opening of the second surface of the first panel through acompressing process (e.g., the compression process of FIG. 12 or 13).For example, the electronic device may further include a protrusion(e.g., the protrusion 1010 of FIGS. 10A and 10B) disposed on the firstlayer in an area between the second opening and the first opening, andhaving a closed-loop shape.

According to an example embodiment, an entire exposed through the firstopening of the second surface of the first panel may be covered by thesensor. For example, a portion of the sensor may be attached to thesecond surface of the first panel by an adhesive material (e.g., theadhesive material 1510 of FIG. 15) filled in the first opening throughthe first opening and a remaining portion of the sensor may be attachedonto the first layer.

According to various example embodiments, a display module (e.g., thedisplay module 200 of FIGS. 4A and 4B) may include: a first panel (e.g.,the first panel 210 of FIGS. 4A and 4B) including a first surface, asecond surface opposite the first surface, and a plurality of pixelsinterposed between the first surface and the second surface; a coverlayer (e.g., the cover layer 230 of FIGS. 4A and 4B) disposed on thefirst surface of the first panel; a second panel (e.g., the second panel220 of FIGS. 4A and 4B) disposed on the second surface of the firstpanel; and a sensor (e.g., the sensor 240 of FIGS. 4A and 4B) coupled tothe second surface of the first panel. The sensor may be coupled to thesecond surface of the first panel. For example, the sensor may form asensing area (e.g., the sensing area 110F of FIG. 1) on one surface ofthe housing. The display module may include an opening (e.g., theopening 225 of FIGS. 4A and 4B) extending through the second panel andat least a portion of the sensor may be disposed in the opening, and thesecond panel may include a first layer (e.g., the first layer 510 ofFIG. 5) coupled to the first panel on one surface of the second paneland a second layer (e.g., the second layer 520 of FIG. 5) coupled to thefirst layer on a surface opposite the one surface of the first layer.The opening may include a first opening (e.g., the first opening 610 ofFIG. 6) in the first layer, and the first opening may be provided insidea closed area of a second opening (e.g., the second opening 620 of FIG.6) in the second layer. A circumference of the first opening may bespaced apart from a circumference of the second opening in the secondlayer by at least a specified distance.

According to an example embodiment, the second layer may include aconductive layer configured to provide electrical shielding, and thefirst layer may include a layer configured to provide optical shielding.

According to an example embodiment, the sensor may be attached to thesecond surface of the first panel through an adhesive material (e.g.,the adhesive material 890 of FIG. 9B) in the first opening Theelectronic device may further include a light shielding material (e.g.,the light shielding material 910 of FIG. 9B) in a mounting area formedby the adhesive material of the second surface of the first panel and anarea between the mounting area and the first opening. For example, thelight shielding material may have a specified viscosity or less and maybe dried at a room temperature.

According to an example embodiment, the display module may furtherinclude a protrusion (e.g., the protrusion 1010 of FIGS. 10A and 10B)disposed on the first layer and in an area between the second openingand the first opening, and having a closed-loop shape.

According to an example embodiment, the display module may furtherinclude a light shielding adhesive material (e.g., the light shieldingadhesive material 1110 of FIGS. 11A and 11B) applied to an entire areaexposed through the first opening of the second surface of the firstpanel. The sensor may be attached to the second surface of the firstpanel by the light shielding adhesive material. For example, the lightshielding adhesive material may be applied to the entire area exposedthrough the first opening of the second surface of the first panelthrough a compressing process (e.g., the compression process of FIG. 12or 13). For example, the electronic device may further include aprotrusion (e.g., the protrusion 1010 of FIGS. 10A and 10B) disposed onthe first layer in an area between the second opening and the firstopening, and having a closed-loop shape.

According to an example embodiment, an entire area exposed through thefirst opening of the second surface of the first panel may be covered bythe sensor. For example, a portion of the sensor may be attached to thesecond surface of the first panel by an adhesive material (e.g., theadhesive material 1510 of FIG. 15) filled in the first opening and aremaining portion of the sensor may be attached onto the first layer.

Various embodiments of the disclosure and terms used herein are notintended to limit the technologies described in the disclosure tospecific embodiments, and it should be understood that the embodimentsand the terms include various modifications, equivalents, and/oralternatives on the corresponding embodiments described herein. Withregard to description of drawings, similar components may be marked bysimilar reference numerals. The terms of a singular form may includeplural forms unless otherwise specified. In the disclosure disclosedherein, the expressions “A or B”, “at least one of A and/or B”, “A, B,or C”, or “at least one of A, B, and/or C”, and the like used herein mayinclude any and all combinations of one or more of the associated listeditems. Expressions such as “first,” or “second,” and the like, mayexpress their components regardless of their priority or importance andmay be used to distinguish one component from another component but isnot limited to these components. When an (e.g., first) component isreferred to as being “(operatively or communicatively) coupled with/to”or “connected to” another (e.g., second) component, it may be directlycoupled with/to or connected to the other component or an interveningcomponent (e.g., a third component) may be present.

According to the situation, the expression “adapted to or configured to”used herein may be interchangeably used as, for example, the expression“suitable for”, “having the capacity to”, “changed to”, “made to”,“capable of” or “designed to” in hardware or software. The expression “adevice configured to” may refer, for example, to the device being“capable of” operating together with another device or other parts. Forexample, a “processor configured to (or set to) perform A, B, and C” mayrefer, for example, to a dedicated processor (e.g., an embeddedprocessor) for performing corresponding operations or a generic-purposeprocessor (e.g., a central processing unit (CPU) or an applicationprocessor (AP)) which performs corresponding operations by executing oneor more software programs which are stored in a memory device.

The term “module” used herein may include a unit, which is implementedwith hardware, software, or firmware, or any combination thereof, andmay be interchangeably used with the terms “logic”, “logical block”,“part”, or “circuit”. The “module” may be a minimum unit of anintegrated part or a part thereof or may be a minimum unit forperforming one or more functions or a part thereof. The “module” may beimplemented mechanically or electronically and may include, for example,an application-specific IC (ASIC) chip, a field-programmable gate array(FPGA), and a programmable-logic device for performing some operations,which are known or will be developed.

At least a part of an apparatus (e.g., modules or functions thereof) ora method (e.g., operations) according to various embodiments may be, forexample, implemented by instructions stored in a computer-readablestorage media in the form of a program module. The instruction, whenexecuted by a processor, may cause the processor to perform a functioncorresponding to the instruction. The computer-readable recording mediummay include a hard disk, a floppy disk, a magnetic media (e.g., amagnetic tape), an optical media (e.g., a compact disc read only memory(CD-ROM) and a digital versatile disc (DVD), a magneto-optical media(e.g., a floptical disk)), an embedded memory, and the like. The one ormore instructions may contain a code made by a compiler or a codeexecutable by an interpreter.

Each component (e.g., a module or a program module) according to variousembodiments may be include a single entity or a plurality of entities, apart of the above-described sub-components may be omitted, or othersub-components may be further included. Alternatively or additionally,after being integrated in one entity, some components (e.g., a module ora program module) may identically or similarly perform the functionexecuted by each corresponding component before integration. Accordingto various embodiments, operations executed by modules, program modules,or other components may be executed by a successive method, a parallelmethod, a repeated method, or a heuristic method, or at least one partof operations may be executed in different sequences or omitted.Alternatively, other operations may be added.

According to various embodiments disclosed in the disclosure, the sensormounting area positioned under the display may be prevented from and/oravoid being viewed from the outside of the electronic device.

According to various embodiments disclosed in the disclosure, theadhesive material may be prevented from and/or avoid being absorbed intoa buffer layer.

Besides, a variety of effects directly or indirectly understood throughthe disclosure may be provided.

While the disclosure has been illustrated and described with referenceto various example embodiments thereof, it will be understood that thevarious example embodiments are intended to be illustrative, notlimiting. It will also be understood by those skilled in the art thatvarious changes in form and details may be made therein withoutdeparting from the true spirit and full scope of the disclosure,including the appended claims and their equivalents.

What is claimed is:
 1. An electronic device comprising: a housing; adisplay including a first panel having a plurality of pixels interposedbetween a first surface and a second surface opposite the first surface,a cover layer disposed on the first surface, and a second panel disposedon the second surface; and a sensor coupled to the second surface of thefirst panel of the display, wherein the display includes an opening inthe second panel, wherein at least a portion of the sensor is disposedin the opening, wherein the second panel includes: a first layer coupledto the first panel on one surface of the second panel, and a secondlayer coupled to the first layer on a surface opposite the one surface,wherein the opening includes a first opening in the first layer, whereinthe first opening is provided in a closed area of a second opening inthe second layer, and wherein a circumference of the first opening isspaced apart from a circumference of the second opening in the secondlayer.
 2. The electronic device of claim 1, wherein the second layerincludes a conductive layer configured to provide electrical shielding,and wherein the first layer includes a layer configured to provideoptical shielding.
 3. The electronic device of claim 2, wherein thesensor is attached to the second surface of the first panel through anadhesive material disposed in the first opening, and wherein theelectronic device further includes: a light shielding material disposedin a mounting area of the second surface of the first panel between theadhesive material and the first opening.
 4. The electronic device ofclaim 3, wherein the light shielding material has a specified viscosityor less, and is configured to be dried at a room temperature.
 5. Theelectronic device of claim 3, further comprising: a protrusion disposedon the first layer in an area between the second opening and the firstopening, the protrusion having a closed-loop shape.
 6. The electronicdevice of claim 2, further comprising: a light shielding adhesivematerial disposed on an entire area of the second surface of the firstpanel exposed through the first opening, wherein the sensor is attachedto the second surface of the first panel by the light shielding adhesivematerial.
 7. The electronic device of claim 6, wherein the lightshielding adhesive material is provided in an entire area of the secondsurface of the first panel exposed through the first opening bycompression.
 8. The electronic device of claim 7, further comprising: aprotrusion provided on the first layer in an area between the secondopening and the first opening, the protrusion having a closed-loopshape.
 9. The electronic device of claim 2, wherein an entire area ofthe second surface of the first panel exposed through the first openingis covered by the sensor.
 10. The electronic device of claim 9, whereina portion of the sensor is attached to the second surface of the firstpanel though the first opening by an adhesive material provided in thefirst opening, and wherein a remaining portion of the sensor is attachedto the first layer.
 11. A display module comprising: a first panelincluding a first surface, a second surface opposite the first surface,and a plurality of pixels interposed between the first surface and thesecond surface; a cover layer disposed on the first surface of the firstpanel; a second panel disposed on the second surface of the first panel;and a sensor coupled to the second surface of the first panel, whereinthe second panel includes a first layer coupled to the first panel onone surface of the second panel and a second layer coupled to the firstlayer, on a surface opposite to the one surface, wherein the secondpanel includes an opening extending through the second panel, wherein atleast a portion of the sensor is disposed in the opening, wherein theopening includes a first opening in the first layer, wherein the firstopening is provided inside a closed area of a second opening in thesecond layer, and wherein a circumference of the first opening is spacedapart from a circumference of the second opening on the second layer.12. The display module of claim 11, wherein the second layer includes aconductive layer configured to provide electrical shielding, and whereinthe first layer includes a layer configured to provide opticalshielding.
 13. The display module of claim 12, wherein the sensor isattached to the second surface of the first panel through an adhesivematerial disposed in the first opening, and wherein the display modulefurther includes: a light shielding material disposed in a mounting areaof the second surface of the first panel between the adhesive materialand the first opening.
 14. The display module of claim 13, wherein thelight shielding material has a specified viscosity or less, and isconfigured to be dried at a room temperature.
 15. The display module ofclaim 13, further comprising: a protrusion disposed on the first layerin an area between the second opening and the first opening, theprotrusion having a closed-loop shape.
 16. The display module of claim12, further comprising: a light shielding adhesive material disposed onan entire area of the second surface of the first panel exposed throughthe first opening, wherein the sensor is attached to the second surfaceof the first panel by the light shielding adhesive material.
 17. Thedisplay module of claim 16, wherein the light shielding adhesivematerial is disposed on the entire area of the second surface of thefirst panel exposed through the first opening by compression.
 18. Thedisplay module of claim 17, further comprising: a protrusion disposed onthe first layer in an area between the second opening and the firstopening, the protrusion having a closed-loop shape.
 19. The displaymodule of claim 12, wherein an entire area of the second surface of thefirst panel exposed through the first opening is covered by the sensor.20. The display module of claim 19, wherein a portion of the sensor isattached to the second surface of the first panel through the firstopening by an adhesive material disposed in the first opening, andwherein a remaining portion of the sensor is attached to the firstlayer.